Electronic Packaging Training

Electronic Packaging Training

Introduction:

Electronic Packaging Training Course Description

This three-day Electronic Packaging Training includes fundamentals of electronic packaging engineering and basic concepts in thermal, mechanical, electrical, and environmental management of modern electronic systems. Emphasis is on high-frequency (and high-speed) package performance and its achievement through the use of advanced analytical tools, proper materials selection, and efficient computer-aided design. Packaging topics include die and lead attachment, substrates, hybrids, surface-mount technology, chip and board environmental protection, connectors, harnesses, and printed and embedded wiring boards. Students develop a fundamental understanding of the basic principles used in the packaging of modern electronics so that when faced with a packaging issue they can recognize the various methods available and perform the tradeoffs necessary to select the appropriate/optimum packaging solution for the application. Case studies for satellite design will be covered.

Electronic Packaging TrainingRelated Courses:

Duration:3 days

Skills Gained:

• Students master fundamental knowledge of electronic packaging including package styles, hierarchy, and methods of package necessary for various environments.
• The student should be able to perform simple thermal models and make appropriate trade offs involving materials and structures to solve electronic heating problems.
• Basic understanding and application of electronic packaging models and electrical performance concepts such as impedance, loss, time delay, risetime, etc.
• The ability to distinguish between engineering performance and economic efficiency and develop cost efficient high performing packaging approaches. The student understands reliability models and the information necessary to predict the reliability of electronic components and structures.

Customize It:

With onsite Training, courses can be scheduled on a date that is convenient for you, and because they can be scheduled at your location, you don’t incur travel costs and students won’t be away from home. Onsite classes can also be tailored to meet your needs. You might shorten a 5-day class into a 3-day class, or combine portions of several related courses into a single course, or have the instructor vary the emphasis of topics depending on your staff’s and site’s requirements.

Course Content:

Introduction

Electronic Packaging Concepts

Packaging Economics

Packaging Design I

Packaging Design Ii

Substrates

Printed Wiring Boards

Level 1 Interconnect

Level 2 Interconnect

Level 3 Interconnect

Environmental Protection

Reliability

System Packaging

Case Studies of Satellite Applications

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Time Frame: 0-3 Months4-12 Months

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